Curamik Ceramic Substrates

The low coefficient of thermal expansion of the ceramic substrate means they outperform substrates based on metal or plastic.

Curamik ceramic substrates.

The doping process provides enhanced robustness and improved properties when exposed to mechanical constraints. Curamik ceramic substrates technical data sheet total dimensions master card 138 mm x 190 5 mm 1 5 max. The substrates ain direct bond copper dbc provides an adjusted thermal expansion coefficient which is closer to that of silicon and results in little tension in the solder layer between chip and substrate. Our curamik performance substrates are based on si 3 n 4 ceramics joined with copper by active metal brazing amb.

Partial discharge free substrates free of partial discharge for power modules 1 7 kv. Our curamik thermal substrates offer the best thermal conductivity in the industry. Our curamik power plus substrates are based on zr doped al 2 o 3 hps ceramic. Aln ceramic substrates market globally by 2025.

These substrates are ideal for applications that demand a long lifetime high power density and robustness. These substrates offer a longer lifetime and greater reliability and performance than alumina substrates and it comes at a competitive price point. Contact our sales specialists for further information about curamik advantage. Curamik high temperature high voltage substrates consist of pure copper bonded to a ceramic substrate such as al2o3 alumina aln aluminum nitride hps zro2 doped or silicon based si3n4 silicon nitride.

Our curamik ceramic substrates offer high heat conductivity high heat capacity and thermal spreading of the substrates thick copper cladding making our substrates indispensable to power electronics. 3 µm 7 µm 8 2 p all. Global dbc ceramic substrate market 2020 rogers curamik germany kcc korea ferrotec shanghai shenhe thermo magnetics electronics china sourabhkshirsagardm uncategorized april 27 2020 2 minutes. At ceramic substrates we operate with a bank of nine cnc s twelve traditional lathes and mills producing fully engineered machinable ceramic components six days a week.

Our engineers have an international reputation for machining to a very high degree of accuracy. Dbc direct bond copper a high tem. Useable area 127 mm x 178 mm 0 05 copper peeling strength 4 0 n mm 50 mm min for dbc with 0 3 mm cu thickness 10 0 n mm 50 mm min for amb with 0 5 mm cu thickness platings electroless ni.